Product Data Sheet Show all documents

Sikafloor® PS

Epoxy Resin Pore Sealing and Smoothing Putty

Sikafloor® PS is a solvent-free, thixotropic, two component, epoxy resin based putty for minor repairs on concrete surfaces.
Suitable for use in hot and tropical climatic conditions.

Sikafloor® PS is an extremely versatile product that offers many advantages to the user:
  • Easy to apply
  • Suitable for dry and damp surfaces
  • Cost effective; consumption of subsequent coatings is reduced
  • Non-shrink
  • Excellent mechanical strengths
  • Excellent adhesion to concrete substrates
  • High abrasion and impact resistance
  • High chemical resistance
  • Solvent free
Product Data Sheet Show all documents

Usage

Sikafloor® PS can be used in following situations:
  • Concrete minor repairs such as honeycombing, blow holes, pin holes, etc.
  • General smoothing / re-profiling over large areas
  • Suitable for feather edge
  • Filling pinholes prior to over coating with Sikafloor®, Sikadur® and Sikagard® product range
  • Filling cracks and surface sealing
 

Advantages

Sikafloor® PS is an extremely versatile product that offers many advantages to the user:
  • Easy to apply
  • Suitable for dry and damp surfaces
  • Cost effective; consumption of subsequent coatings is reduced
  • Non-shrink
  • Excellent mechanical strengths
  • Excellent adhesion to concrete substrates
  • High abrasion and impact resistance
  • High chemical resistance
  • Solvent free

Packaging

Part A: 4 kg and 16 kg container
Part B: 2 kg and 8 kg container
(A + B) 6 kg and 24 kg ready to mix units

Colour

Grey (Mixed A + B)

Component A: White

Component B: Black

 

Product Details

Product Information

Composition

Epoxy resin

Shelf life

24 months from date of production

Storage conditions

Store in cool and dry conditions in unopened, undamaged and sealed original packaging at temperatures between +5 °C and +35 °C protected from direct sunlight, heat and moisture.

Density

~1.75 kg/l (mixed resin)

Solid content

100 %

 
Technical Information

Compressive strength

25° C

1 Day

7 Days

14 Days

≥ 35 N/mm2

≥ 46 N/mm2

≥ 50 N/mm2

Tensile adhesion strength

≥ 1.5 N/mm2 (7 d)

Application

Application Information

Mixing ratio

Part A : Part B = 2 : 1 by weight

Layer thickness

Maximum 3 mm in one single layer.

Ambient air temperature

+5° C min. / +45° C max.

Dew point

Beware of condensation!

The substrate temparture must be at least 3 ° C above dew piont.

Substrate temperature

+5° C min. / +45° C max.

Pot Life

~45 min. (+25 °C)*

*200 g

The potlife begins when the resin and hardener are mixed. It is shorter at high temperatures and longer at low temperatures. The greater the quantity mixed, the shorter the potlife. To obtain longer workability at high temperatures, the mixed adhesive may be divided into portions. Another method is to chill components A and B before mixing them (not below +5 °C).

Curing time

Sikafloor® PS can be over coated with various Sikafloor®, Sikadur® and Sikagard® resins after 12 hours and not later than 24 hours at 30 °C. Sikafloor® PS is fully cured after 7 days. For more details please contact Sika Technical Department.
Consumption

Consumption

~ 1.75 kg / m2 / mm

This figure is theoretical and does not include for any additional material required due to surface porosity, surface profile, variations in level or wastage etc.
Application steps

MIXING

Mix components (A and B) together for at least 3 minutes with a mixing paddle attached to a slow speed electric drill (maximum 400 rpm) until the material becomes smooth in consistency and an even grey colour of the mixture is obtained. Material in industrial packing must be stirred well before proportioning and mixing. Avoid aeration while mixing. Sikafloor® PS is supplied ready for use and only has to be thoroughly stirred.

APPLICATION

Sikafloor® PS has easy workability and can be applied by trowel, scraper, or spatula.
 

CLEANING OF EQUIPMENT

Clean all equipment and tools with Sika® Colma Cleaner immediately after use. Hardened / cured material can only be removed by mechanical means.

Documents